Thermal contact conductance / / Chakravarti V. Madhusudana
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| Autore: |
Madhusudana Chakravarti V
|
| Titolo: |
Thermal contact conductance / / Chakravarti V. Madhusudana
|
| Pubblicazione: | Cham [Switzerland] : , : Springer, , 2014 |
| Edizione: | 2nd ed. 2014. |
| Descrizione fisica: | 1 online resource (xviii, 260 pages) : illustrations (some color) |
| Disciplina: | 621.402 |
| 621.402/2 | |
| 621.4021 | |
| Soggetto topico: | Heat - Conduction |
| Surfaces (Technology) | |
| Mechanical engineering | |
| Note generali: | "ISSN: 0941-5122." |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Nota di contenuto: | Introduction -- Thermal Constriction Resistance -- Solid Spot Thermal Conductance of a Joint -- Gap Conductance at the Interface.-Experimental Aspects -- Special Configurations and Processes -- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings -- Major Applications -- Additional Topics -- Concluding Remarks. |
| Sommario/riassunto: | This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field. |
| Titolo autorizzato: | Thermal Contact Conductance |
| ISBN: | 3-319-01276-2 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910299480903321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
Mechanical engineering series (Berlin, Germany)