LEADER 02398oam 2200505 450 001 9910299480903321 005 20190911112725.0 010 $a3-319-01276-2 024 7 $a10.1007/978-3-319-01276-6 035 $a(OCoLC)869772154 035 $a(MiFhGG)GVRL6WGH 035 $a(EXLCZ)992670000000429030 100 $a20130627d2014 uy 0 101 0 $aeng 135 $aurun|---uuuua 181 $ctxt 182 $cc 183 $acr 200 10$aThermal contact conductance /$fChakravarti V. Madhusudana 205 $a2nd ed. 2014. 210 1$aCham [Switzerland] :$cSpringer,$d2014. 215 $a1 online resource (xviii, 260 pages) $cillustrations (some color) 225 1 $aMechanical Engineering Series,$x0941-5122 300 $a"ISSN: 0941-5122." 311 $a3-319-01275-4 320 $aIncludes bibliographical references and index. 327 $aIntroduction -- Thermal Constriction Resistance -- Solid Spot Thermal Conductance of a Joint -- Gap Conductance at the Interface.-Experimental Aspects -- Special Configurations and Processes -- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings -- Major Applications -- Additional Topics -- Concluding Remarks. 330 $aThis book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field. 410 0$aMechanical engineering series (Berlin, Germany) 606 $aHeat$xConduction 606 $aSurfaces (Technology) 606 $aMechanical engineering 615 0$aHeat$xConduction. 615 0$aSurfaces (Technology) 615 0$aMechanical engineering. 676 $a621.402 676 $a621.402/2 676 $a621.4021 700 $aMadhusudana$b Chakravarti V$4aut$4http://id.loc.gov/vocabulary/relators/aut$0999564 801 0$bMiFhGG 801 1$bMiFhGG 906 $aBOOK 912 $a9910299480903321 996 $aThermal Contact Conductance$92294307 997 $aUNINA