02398oam 2200505 450 991029948090332120190911112725.03-319-01276-210.1007/978-3-319-01276-6(OCoLC)869772154(MiFhGG)GVRL6WGH(EXLCZ)99267000000042903020130627d2014 uy 0engurun|---uuuuatxtccrThermal contact conductance /Chakravarti V. Madhusudana2nd ed. 2014.Cham [Switzerland] :Springer,2014.1 online resource (xviii, 260 pages) illustrations (some color)Mechanical Engineering Series,0941-5122"ISSN: 0941-5122."3-319-01275-4 Includes bibliographical references and index.Introduction -- Thermal Constriction Resistance -- Solid Spot Thermal Conductance of a Joint -- Gap Conductance at the Interface.-Experimental Aspects -- Special Configurations and Processes -- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings -- Major Applications -- Additional Topics -- Concluding Remarks.This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field.Mechanical engineering series (Berlin, Germany)HeatConductionSurfaces (Technology)Mechanical engineeringHeatConduction.Surfaces (Technology)Mechanical engineering.621.402621.402/2621.4021Madhusudana Chakravarti Vauthttp://id.loc.gov/vocabulary/relators/aut999564MiFhGGMiFhGGBOOK9910299480903321Thermal Contact Conductance2294307UNINA