SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / / Suny Li
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| Autore: |
Li Suny <1974->
|
| Titolo: |
SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / / Suny Li
|
| Pubblicazione: | Hoboken, New Jersey ; ; Fusionopolis, Solaris South Tower, Singapore : , : Publishing House of Electronics Industry : , : Wiley, , 2017 |
| ©2017 | |
| Descrizione fisica: | 1 online resource |
| Disciplina: | 621.3815 |
| Soggetto topico: | Integrated circuits - Design and construction |
| Multichip modules (Microelectronics) - Design and construction | |
| Nota di bibliografia: | Includes bibliographical references and indexes. |
| Nota di contenuto: | SiP design and simulation platform -- Basic knowledge of package -- SiP production process -- New package technologies -- SiP design and simulation flow -- Central library -- Schematic input -- Multi-board project management and schematic concurrent design -- Layout creation and setting -- Constraint rules management -- Wire bond design -- Cavity and chip stack design -- FlipChip and RDL design -- Route and plane -- Embedded passives design -- RF circuit design -- Layout concurrent design -- 3D real-time DRC -- Design review -- Manufacture data output -- SiP simulation technology. |
| Titolo autorizzato: | SiP-system in package design and simulation |
| ISBN: | 1-119-04601-7 |
| 1-119-04599-1 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910271009603321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |