SiP-system in package design and simulation : MentorGraphics Expedition Enterprise Flow advanced design guide / / Suny Li

• Record Nr.: UNINA9910271009603321
• Autore: Li Suny <1974->
• Pubbl/distr/stampa: Hoboken, New Jersey ; ; Fusionopolis, Solaris South Tower, Singapore : , : Publishing House of Electronics Industry : , : Wiley, , 2017; ©2017
• ISBN: 1-119-04601-7; 1-119-04599-1
• Descrizione fisica: 1 online resource
• Disciplina: 621.3815
• Soggetti: Integrated circuits - Design and construction; Multichip modules (Microelectronics) - Design and construction
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Nota di bibliografia: Includes bibliographical references and indexes.
• Nota di contenuto: SiP design and simulation platform -- Basic knowledge of package -- SiP production process -- New package technologies -- SiP design and simulation flow -- Central library -- Schematic input -- Multi-board project management and schematic concurrent design -- Layout creation and setting -- Constraint rules management -- Wire bond design -- Cavity and chip stack design -- FlipChip and RDL design -- Route and plane -- Embedded passives design -- RF circuit design -- Layout concurrent design -- 3D real-time DRC -- Design review -- Manufacture data output -- SiP simulation technology.