02215nam 2200481 450 991027100960332120230809225037.01-119-04601-71-119-04599-1(CKB)3710000001633623(DLC) 2017011202(Au-PeEL)EBL4915580(CaPaEBR)ebr11412608(CaONFJC)MIL1021882(OCoLC)974912967(MiAaPQ)EBC4915580(EXLCZ)99371000000163362320170811h20172017 uy 0engur|||||||||||rdacontentrdamediardacarrierSiP-system in package design and simulation MentorGraphics Expedition Enterprise Flow advanced design guide /Suny LiHoboken, New Jersey ;Fusionopolis, Solaris South Tower, Singapore :Publishing House of Electronics Industry :Wiley,2017.©20171 online resource1-119-04593-2 Includes bibliographical references and indexes.SiP design and simulation platform -- Basic knowledge of package -- SiP production process -- New package technologies -- SiP design and simulation flow -- Central library -- Schematic input -- Multi-board project management and schematic concurrent design -- Layout creation and setting -- Constraint rules management -- Wire bond design -- Cavity and chip stack design -- FlipChip and RDL design -- Route and plane -- Embedded passives design -- RF circuit design -- Layout concurrent design -- 3D real-time DRC -- Design review -- Manufacture data output -- SiP simulation technology.Integrated circuitsDesign and constructionMultichip modules (Microelectronics)Design and constructionIntegrated circuitsDesign and construction.Multichip modules (Microelectronics)Design and construction.621.3815Li Suny1974-874373MiAaPQMiAaPQMiAaPQBOOK9910271009603321SiP-system in package design and simulation1952290UNINA