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Autore: | Lau John H |
Titolo: | Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee |
Pubblicazione: | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020 |
Edizione: | 1st ed. 2020. |
Descrizione fisica: | 1 online resource (545 pages) |
Disciplina: | 671.56 |
Soggetto topico: | Joints (Engineering) |
Solder and soldering | |
Persona (resp. second.): | LeeNing-Cheng |
Nota di contenuto: | Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. |
Sommario/riassunto: | This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. |
Titolo autorizzato: | Assembly and Reliability of Lead-Free Solder Joints |
ISBN: | 981-15-3920-0 |
Formato: | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione: | Inglese |
Record Nr.: | 9910403764003321 |
Lo trovi qui: | Univ. Federico II |
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