LEADER 02667oam 22004575 450 001 9910403764003321 005 20231214165510.0 010 $a981-15-3920-0 024 7 $a10.1007/978-981-15-3920-6 035 $a(CKB)4100000011273640 035 $a(MiAaPQ)EBC6213179 035 $a(DE-He213)978-981-15-3920-6 035 $a(PPN)248393529 035 $a(EXLCZ)994100000011273640 100 $a20200529d2020 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aAssembly and reliability of lead-free solder joints /$fJohn H. Lau, Ning-Cheng Lee 205 $a1st ed. 2020. 210 1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d2020. 215 $a1 online resource (545 pages) 311 0 $a981-15-3919-7 327 $aSolder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. 330 $aThis book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 606 $aJoints (Engineering) 606 $aSolder and soldering 615 0$aJoints (Engineering) 615 0$aSolder and soldering. 676 $a671.56 700 $aLau$b John H$4aut$4http://id.loc.gov/vocabulary/relators/aut$0972648 702 $aLee$b Ning-Cheng$4aut$4http://id.loc.gov/vocabulary/relators/aut 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910403764003321 996 $aAssembly and Reliability of Lead-Free Solder Joints$92504101 997 $aUNINA