02667oam 22004575 450 991040376400332120231214165510.0981-15-3920-010.1007/978-981-15-3920-6(CKB)4100000011273640(MiAaPQ)EBC6213179(DE-He213)978-981-15-3920-6(PPN)248393529(EXLCZ)99410000001127364020200529d2020 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierAssembly and reliability of lead-free solder joints /John H. Lau, Ning-Cheng Lee1st ed. 2020.Singapore :Springer Singapore :Imprint: Springer,2020.1 online resource (545 pages)981-15-3919-7 Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.Joints (Engineering)Solder and solderingJoints (Engineering)Solder and soldering.671.56Lau John Hauthttp://id.loc.gov/vocabulary/relators/aut972648Lee Ning-Chengauthttp://id.loc.gov/vocabulary/relators/autMiAaPQMiAaPQMiAaPQBOOK9910403764003321Assembly and Reliability of Lead-Free Solder Joints2504101UNINA