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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers



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Titolo: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers Visualizza cluster
Pubblicazione: Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
Descrizione fisica: 1 online resource (78 pages)
Disciplina: 621.381011
Soggetto topico: Microelectronics - Simulation methods
Systems engineering - Simulation methods
Titolo autorizzato: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems  Visualizza cluster
ISBN: 1-5386-8040-8
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 996575392303316
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