1.

Record Nr.

UNISA996575392303316

Titolo

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers

Pubbl/distr/stampa

Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019

ISBN

1-5386-8040-8

Descrizione fisica

1 online resource (78 pages)

Disciplina

621.381011

Soggetti

Microelectronics - Simulation methods

Systems engineering - Simulation methods

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia