01476nam 2200361 450 99657539230331620230817193521.01-5386-8040-8(CKB)4100000008337692(WaSeSS)IndRDA00123017(EXLCZ)99410000000833769220200516d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 24-27 March 2019, Hannover, Germany /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2019.1 online resource (78 pages)1-5386-8041-6 MicroelectronicsSimulation methodsCongressesSystems engineeringSimulation methodsCongressesMicroelectronicsSimulation methodsSystems engineeringSimulation methods621.381011Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING9965753923033162019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2546304UNISA