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1997 International Symposium on Advanced Packaging Materials



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Titolo: 1997 International Symposium on Advanced Packaging Materials Visualizza cluster
Pubblicazione: [Place of publication not identified], : IEEE, 1997
Disciplina: 621.381/046
Soggetto topico: Electronic packaging - Materials - Congresses
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Note generali: Bibliographic Level Mode of Issuance: Monograph
Titolo autorizzato: 1997 International Symposium on Advanced Packaging Materials  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 996217390403316
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
Proceedings of the 1997 1st Electronic Packaging Technology Conference
Electrical performance of electronic packaging : November 2-4, 1994, Monterey Plaza Hotel, Monterey, California