LEADER 01605oam  2200469zu 450 
001 996217390403316
005 20210807003354.0
035   $a(CKB)111026746718334
035   $a(SSID)ssj0000445433
035   $a(PQKBManifestationID)12142966
035   $a(PQKBTitleCode)TC0000445433
035   $a(PQKBWorkID)10482057
035   $a(PQKB)10043910
035   $a(EXLCZ)99111026746718334
100   $a20160829d1997      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1997 International Symposium on Advanced Packaging Materials
210 31$a[Place of publication not identified]$cIEEE$d1997
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-3818-9 
606   $aElectronic packaging$xMaterials$xCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aElectronic packaging$xMaterials$xCongresses
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/046
712 02$aGeorgia Institute of Technology
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aASM International
712 02$aIEEE, Inc. Staff
712 12$aInternational Symposium on Advanced Packaging Materials
801  0$bPQKB
906   $aBOOK
912   $a996217390403316
996   $a1997 International Symposium on Advanced Packaging Materials$92526968
997   $aUNISA