01605oam 2200469zu 450 99621739040331620210807003354.0(CKB)111026746718334(SSID)ssj0000445433(PQKBManifestationID)12142966(PQKBTitleCode)TC0000445433(PQKBWorkID)10482057(PQKB)10043910(EXLCZ)9911102674671833420160829d1997 uy engtxtccr1997 International Symposium on Advanced Packaging Materials[Place of publication not identified]IEEE1997Bibliographic Level Mode of Issuance: Monograph0-7803-3818-9 Electronic packagingMaterialsCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCElectronic packagingMaterialsCongressesElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381/046Georgia Institute of TechnologyComponents, Packaging & Manufacturing Technology SocietyASM InternationalIEEE, Inc. StaffInternational Symposium on Advanced Packaging MaterialsPQKBBOOK9962173904033161997 International Symposium on Advanced Packaging Materials2526968UNISA