Microelectronics failure analysis : desk reference / / edited by Richard J. Ross

• Pubblicazione: Materials Park, Ohio, : ASM International, c2011
• Edizione: 6th ed.
• Descrizione fisica: 1 online resource (672 p.)
• Disciplina: 621.381
• Soggetto topico: Electronics - Materials - Testing; Microelectronics - Materials - Testing; Microelectronics - Materials - Defects; Electronic apparatus and appliances - Testing; Semiconductors - Defects
• Altri autori: RossRichard J
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and indexes.
• Nota di contenuto: section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information.
• Sommario/riassunto: This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: * Failure Analysis Process Flow * Failure Verification * Failure Modes and Failure Classification * Special Devices (MEMS, Optoelectronics, Passives) * Fault Localisation Techniques: Package Level (NDT) * Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) * Deprocessing & Imaging Techniques: Deprocessing * General Imaging Techniques * Local Deprocessing & Imaging * Circuit Edit and Design Modification * Material Analysis Techniques * Reference Information: Important Topics for Semiconductor Devices * Failure Analysis Techniques Roadmap * Failure Analysis Operations and Management * Appendices: Failure Analysis Terms, Definitions, and Acronyms * Industry Standards
• Titolo autorizzato: Microelectronics failure analysis
• ISBN: 1-61503-726-8; 1-61503-837-X
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9911006561003321
• Lo trovi qui: Univ. Federico II