02478nam 2200613 a 450 991100656100332120240410151624.01-61503-726-81-61503-837-X(CKB)2550000000080386(EBL)3002453(OCoLC)923571038(SSID)ssj0000623140(PQKBManifestationID)12293002(PQKBTitleCode)TC0000623140(PQKBWorkID)10647583(PQKB)11712690(MiAaPQ)EBC3002453(Au-PeEL)EBL3002453(CaPaEBR)ebr10540838(EXLCZ)99255000000008038620120128d2011 uy 0engur|n|---|||||txtccrMicroelectronics failure analysis[electronic resource] desk reference /edited by Richard J. Ross6th ed.Materials Park, Ohio ASM Internationalc20111 online resource (672 p.)Description based upon print version of record.1-61503-725-X Includes bibliographical references and indexes.section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information.ElectronicsMaterialsTestingHandbooks, manuals, etcMicroelectronicsMaterialsTestingHandbooks, manuals, etcMicroelectronicsMaterialsDefectsHandbooks, manuals, etcElectronic apparatus and appliancesTestingHandbooks, manuals, etcSemiconductorsDefectsHandbooks, manuals, etcElectronicsMaterialsTestingMicroelectronicsMaterialsTestingMicroelectronicsMaterialsDefectsElectronic apparatus and appliancesTestingSemiconductorsDefects621.381Ross Richard J15661MiAaPQMiAaPQMiAaPQBOOK9911006561003321Microelectronics failure analysis4391712UNINA