LEADER 02478nam 2200613 a 450 001 9911006561003321 005 20240410151624.0 010 $a1-61503-726-8 010 $a1-61503-837-X 035 $a(CKB)2550000000080386 035 $a(EBL)3002453 035 $a(OCoLC)923571038 035 $a(SSID)ssj0000623140 035 $a(PQKBManifestationID)12293002 035 $a(PQKBTitleCode)TC0000623140 035 $a(PQKBWorkID)10647583 035 $a(PQKB)11712690 035 $a(MiAaPQ)EBC3002453 035 $a(Au-PeEL)EBL3002453 035 $a(CaPaEBR)ebr10540838 035 $a(EXLCZ)992550000000080386 100 $a20120128d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aMicroelectronics failure analysis$b[electronic resource] $edesk reference /$fedited by Richard J. Ross 205 $a6th ed. 210 $aMaterials Park, Ohio $cASM International$dc2011 215 $a1 online resource (672 p.) 300 $aDescription based upon print version of record. 311 $a1-61503-725-X 320 $aIncludes bibliographical references and indexes. 327 $asection 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information. 606 $aElectronics$xMaterials$xTesting$vHandbooks, manuals, etc 606 $aMicroelectronics$xMaterials$xTesting$vHandbooks, manuals, etc 606 $aMicroelectronics$xMaterials$xDefects$vHandbooks, manuals, etc 606 $aElectronic apparatus and appliances$xTesting$vHandbooks, manuals, etc 606 $aSemiconductors$xDefects$vHandbooks, manuals, etc 615 0$aElectronics$xMaterials$xTesting 615 0$aMicroelectronics$xMaterials$xTesting 615 0$aMicroelectronics$xMaterials$xDefects 615 0$aElectronic apparatus and appliances$xTesting 615 0$aSemiconductors$xDefects 676 $a621.381 701 $aRoss$b Richard J$015661 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911006561003321 996 $aMicroelectronics failure analysis$94391712 997 $aUNINA