Microwave and millimeter-wave electronic packaging / / Rick Sturdivant
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| Autore: |
Sturdivant Rick
|
| Titolo: |
Microwave and millimeter-wave electronic packaging / / Rick Sturdivant
|
| Pubblicazione: | Boston [Massachusetts] ; ; London [England] : , : Artech House, , 2014 |
| [Piscataqay, New Jersey] : , : IEEE Xplore, , [2013] | |
| Descrizione fisica: | 1 online resource (281 p.) |
| Disciplina: | 621.381046 |
| Soggetto topico: | Microelectronic packaging |
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references at the end of each chapters and index. |
| Nota di contenuto: | Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons. |
| Sommario/riassunto: | Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- |
| Titolo autorizzato: | Microwave and millimeter-wave electronic packaging |
| ISBN: | 1-5231-1742-7 |
| 1-60807-698-9 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910808326603321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
Artech House microwave library.