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001 9910808326603321
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010   $a1-5231-1742-7
010   $a1-60807-698-9
035   $a(CKB)2560000000254538
035   $a(EBL)1579692
035   $a(OCoLC)905527317
035   $a(SSID)ssj0001437312
035   $a(PQKBManifestationID)12620082
035   $a(PQKBTitleCode)TC0001437312
035   $a(PQKBWorkID)11445102
035   $a(PQKB)10020856
035   $a(Au-PeEL)EBL1579692
035   $a(CaPaEBR)ebr11069371
035   $a(CaBNVSL)mat09100896
035   $a(IEEE)9100896
035   $a(MiAaPQ)EBC1579692
035   $a(EXLCZ)992560000000254538
100   $a20200730d2013      uy              
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt
182   $cc
183   $acr
200 10$aMicrowave and millimeter-wave electronic packaging /$fRick Sturdivant
210  1$aBoston [Massachusetts] ;$aLondon [England] :$cArtech House,$d2014.
210  2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2013]
215   $a1 online resource (281 p.)
225 1 $aArtech House Microwave Library
300   $aDescription based upon print version of record.
311   $a1-60807-697-0 
320   $aIncludes bibliographical references at the end of each chapters and index.
327   $aIntroduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons.
330   $aPresenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --$cEdited summary from book.
410  0$aArtech House microwave library.
606   $aMicroelectronic packaging
615  0$aMicroelectronic packaging.
676   $a621.381046
700   $aSturdivant$b Rick$01608700
801  0$bCaBNVSL
801  1$bCaBNVSL
801  2$bCaBNVSL
906   $aBOOK
912   $a9910808326603321
996   $aMicrowave and millimeter-wave electronic packaging$93966947
997   $aUNINA