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Record Nr. |
UNINA9910808326603321 |
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Autore |
Sturdivant Rick |
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Titolo |
Microwave and millimeter-wave electronic packaging / / Rick Sturdivant |
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Pubbl/distr/stampa |
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Boston [Massachusetts] ; ; London [England] : , : Artech House, , 2014 |
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[Piscataqay, New Jersey] : , : IEEE Xplore, , [2013] |
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ISBN |
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1-5231-1742-7 |
1-60807-698-9 |
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Descrizione fisica |
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1 online resource (281 p.) |
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Collana |
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Artech House Microwave Library |
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Disciplina |
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Soggetti |
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Microelectronic packaging |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references at the end of each chapters and index. |
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Nota di contenuto |
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Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons. |
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Sommario/riassunto |
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Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- |
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