Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee

• Autore: Lau John H
• Pubblicazione: Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020
• Edizione: 1st ed. 2020.
• Descrizione fisica: 1 online resource (545 pages)
• Disciplina: 671.56
• Soggetto topico: Joints (Engineering); Solder and soldering
• Persona (resp. second.): LeeNing-Cheng
• Nota di contenuto: Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
• Sommario/riassunto: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
• Titolo autorizzato: Assembly and Reliability of Lead-Free Solder Joints
• ISBN: 981-15-3920-0
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910403764003321
• Lo trovi qui: Univ. Federico II