Chiplet design and heterogeneous integration packaging / / John H. Lau

• Autore: Lau John H.
• Pubblicazione: Singapore : , : Springer, , [2023]; ©2023
• Edizione: 1st ed. 2023.
• Descrizione fisica: 1 online resource (542 pages)
• Disciplina: 354.81150006
• Soggetto topico: Integrated circuits - Design and construction; Microelectronic packaging
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
• Sommario/riassunto: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
• Titolo autorizzato: Chiplet Design and Heterogeneous Integration Packaging
• ISBN: 9789811999178; 9789811999161
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910683350203321
• Lo trovi qui: Univ. Federico II