01012nam0-22003251i-450-9900010023704033213-540-08353-7000100237FED01000100237(Aleph)000100237FED0100010023720000920d1977----km-y0itay50------baengMathematical Foundations of Computer Science 1977Proceedings, 6th Symposium, Tatranska Lomnica September 5-9, 1977Edited by Jozef GruskaBerlin [etc.]Springer-Verlag1977Lecture notes in computer science53CiberneticaTeoria dei giochiTeoria degli automiIntelligenza artificiale510.78Gruska,Jozef47432ITUNINARICAUNIMARCBK9900010023704033218-15311219FI1FI1Mathematical Foundations of Computer Science 1977354482UNINAING0100840nam0-22002891i-450-99000584008040332119990530000584008FED01000584008(Aleph)000584008FED0100058400819990530d1878----km-y0itay50------baitay-------001yy<<Il >>Morgante maggioredi Luigi Pulcicon note di Eugenio Camerinidel Sermolli ed altri2. ed. stereotipaMilanoEdoardo Sonzogno1878331 p.18 cmPulci,Luigi<1432-1484>194113Camerini,EugenioITUNINARICAUNIMARCBK990005840080403321BIBL.FOL. 398BIBL. 38620FLFBCFLFBCMorgante maggiore272185UNINA03100nam 22006015 450 991068335020332120251008163615.09789811999178(electronic bk.)978981199916110.1007/978-981-19-9917-8(MiAaPQ)EBC7220679(Au-PeEL)EBL7220679(OCoLC)1374431206(DE-He213)978-981-19-9917-8(PPN)269100458(CKB)26347416200041(EXLCZ)992634741620004120230327d2023 u| 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierChiplet Design and Heterogeneous Integration Packaging /by John H. Lau1st ed. 2023.Singapore :Springer Nature Singapore :Imprint: Springer,2023.1 online resource (542 pages)Print version: Lau, John H. Chiplet Design and Heterogeneous Integration Packaging Singapore : Springer,c2023 9789811999161 Includes bibliographical references and index.State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.ElectronicsElectronic circuitsMicrotechnologyMicroelectromechanical systemsElectronics and Microelectronics, InstrumentationElectronic Circuits and SystemsMicrosystems and MEMSElectronics.Electronic circuits.Microtechnology.Microelectromechanical systems.Electronics and Microelectronics, Instrumentation.Electronic Circuits and Systems.Microsystems and MEMS.354.81150006Lau John H.972648MiAaPQMiAaPQMiAaPQ9910683350203321Chiplet Design and Heterogeneous Integration Packaging3087016UNINA