LEADER 02500nam 2200409 450 001 9910132575303321 005 20240206184551.0 010 $a1-4123-6717-4 024 7 $a10.1522/030145003 035 $a(CKB)3680000000165880 035 $a(NjHacI)993680000000165880 035 $a(EXLCZ)993680000000165880 100 $a20240206d2008 uy 0 101 0 $afre 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aRepre?sentations et pratiques sociales de l'alcoolisation a? la Re?union $esynthe?se de l'e?tude /$fReine-Marie Payet-Venin, Jean-Marie Elliautou, Jean Benoist 210 1$aChicoutimi :$cJ.-M. Tremblay,$d2008. 215 $a1 online resource (20 pages) 225 1 $aClassiques des sciences sociales ;$v3641 327 $a1. Pre?sentation de l'e?tude--Les objectifs, la me?thodologie--Le contexte historique : une culture du rhum--De quelques chiffres qui questionnent ... sur leur sens--2. Des repre?sentations ambivalentes : le "bon poison"--De l'usage tole?re? ... --A l'exce?s : « le feu du corps »--La stigmatisation--Re?cit de Lionel : le fil du rasoir--3. Des pratiques sociales reconnues aux me?susages--Adolescents et jeunes : des premie?res expe?riences au basculement--Des premie?res ivresses ...a? la recherche de l'effet--Des histoires personnelles perturbe?es ... au basculement--Re?cit d'Eulalie : l'abandon--Les adultes : tableaux de la vie de quartier--Re?cit de Gilbert : quand vous avez commence? ... --La famille et l'alcool : des souffrances a? la prise de conscience--Des souffrances familiales aux arrangements--De la victimisation a? la prise de conscience--Et au besoin d'aide--Re?cit de Ce?cile : la femme victime--4. Quelques pistes de re?flexion pour des actions de pre?vention--Le Programme Re?gional de Sante? "Addictions"--Quelques repe?res bibliographiques--Quelques sigles. 410 0$aClassiques des sciences sociales ;$v3641. 517 $aReprésentations et pratiques sociales de l'alcoolisation à la Réunion 606 $aAlcoholism 615 0$aAlcoholism. 676 $a616.861 700 $aPayet-Venin$b Reine-Marie$0900884 702 $aElliautou$b Jean-Marie 702 $aBenoist$b Jean 801 0$bNjHacI 801 1$bNjHacl 906 $aBOOK 912 $a9910132575303321 996 $aRepre?sentations et pratiques sociales de l'alcoolisation a? la Re?union$93909021 997 $aUNINA LEADER 03100nam 22006015 450 001 9910683350203321 005 20251008163615.0 010 $a9789811999178$b(electronic bk.) 010 $z9789811999161 024 7 $a10.1007/978-981-19-9917-8 035 $a(MiAaPQ)EBC7220679 035 $a(Au-PeEL)EBL7220679 035 $a(OCoLC)1374431206 035 $a(DE-He213)978-981-19-9917-8 035 $a(PPN)269100458 035 $a(CKB)26347416200041 035 $a(EXLCZ)9926347416200041 100 $a20230327d2023 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aChiplet Design and Heterogeneous Integration Packaging /$fby John H. Lau 205 $a1st ed. 2023. 210 1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2023. 215 $a1 online resource (542 pages) 311 08$aPrint version: Lau, John H. Chiplet Design and Heterogeneous Integration Packaging Singapore : Springer,c2023 9789811999161 320 $aIncludes bibliographical references and index. 327 $aState-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding. 330 $aThe book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. 606 $aElectronics 606 $aElectronic circuits 606 $aMicrotechnology 606 $aMicroelectromechanical systems 606 $aElectronics and Microelectronics, Instrumentation 606 $aElectronic Circuits and Systems 606 $aMicrosystems and MEMS 615 0$aElectronics. 615 0$aElectronic circuits. 615 0$aMicrotechnology. 615 0$aMicroelectromechanical systems. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aElectronic Circuits and Systems. 615 24$aMicrosystems and MEMS. 676 $a354.81150006 700 $aLau$b John H.$0972648 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 912 $a9910683350203321 996 $aChiplet Design and Heterogeneous Integration Packaging$93087016 997 $aUNINA