LEADER 03100nam  22006015  450 
001 9910683350203321
005 20251008163615.0
010   $a9789811999178$b(electronic bk.)
010   $z9789811999161
024 7 $a10.1007/978-981-19-9917-8
035   $a(MiAaPQ)EBC7220679
035   $a(Au-PeEL)EBL7220679
035   $a(OCoLC)1374431206
035   $a(DE-He213)978-981-19-9917-8
035   $a(PPN)269100458
035   $a(CKB)26347416200041
035   $a(EXLCZ)9926347416200041
100   $a20230327d2023      u|         0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aChiplet Design and Heterogeneous Integration Packaging /$fby John H. Lau
205   $a1st ed. 2023.
210  1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2023.
215   $a1 online resource (542 pages)
311 08$aPrint version: Lau, John H. Chiplet Design and Heterogeneous Integration Packaging Singapore : Springer,c2023 9789811999161 
320   $aIncludes bibliographical references and index.
327   $aState-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
330   $aThe book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
606   $aElectronics
606   $aElectronic circuits
606   $aMicrotechnology
606   $aMicroelectromechanical systems
606   $aElectronics and Microelectronics, Instrumentation
606   $aElectronic Circuits and Systems
606   $aMicrosystems and MEMS
615  0$aElectronics.
615  0$aElectronic circuits.
615  0$aMicrotechnology.
615  0$aMicroelectromechanical systems.
615 14$aElectronics and Microelectronics, Instrumentation.
615 24$aElectronic Circuits and Systems.
615 24$aMicrosystems and MEMS.
676   $a354.81150006
700   $aLau$b John H.$0972648
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
912   $a9910683350203321
996   $aChiplet Design and Heterogeneous Integration Packaging$93087016
997   $aUNINA