Wafer manufacturing : shaping of single crystal silicon wafers / / Imin Kao, Chunhui Chung
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| Autore: |
Kao Imin
|
| Titolo: |
Wafer manufacturing : shaping of single crystal silicon wafers / / Imin Kao, Chunhui Chung
|
| Pubblicazione: | Hoboken, New Jersey : , : John Wiley & Sons, Incorporated, , [2021] |
| ©2021 | |
| Edizione: | First edition. |
| Descrizione fisica: | 1 online resource (307 pages) : illustrations |
| Disciplina: | 621.38152 |
| Soggetto topico: | Semiconductor wafers - Design and construction |
| Persona (resp. second.): | ChungChunhui |
| Note generali: | Includes index. |
| Sommario/riassunto: | "A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."-- |
| Titolo autorizzato: | Wafer manufacturing |
| ISBN: | 1-118-69625-5 |
| 1-118-69623-9 | |
| 1-118-69622-0 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910830592903321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |