LEADER 02135oam  2200469   450 
001 9910830592903321
005 20210615234443.0
010   $a1-118-69625-5
010   $a1-118-69623-9
010   $a1-118-69622-0
035   $a(CKB)4330000000006815
035   $a(MiAaPQ)EBC6452654
035   $a(OCoLC)1183400300
035   $a(OCoLC-P)1183400300
035   $a(CaSebORM)9780470061213
035   $a(EXLCZ)994330000000006815
100   $a20210615d2021      uy             0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aWafer manufacturing $eshaping of single crystal silicon wafers /$fImin Kao, Chunhui Chung
205   $aFirst edition.
210  1$aHoboken, New Jersey :$cJohn Wiley & Sons, Incorporated,$d[2021]
210  4$d©2021
215   $a1 online resource (307 pages) $cillustrations
300   $aIncludes index.
311   $a0-470-06121-9 
330   $a"A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."--$cProvided by publisher.
606   $aSemiconductor wafers$xDesign and construction
615  0$aSemiconductor wafers$xDesign and construction.
676   $a621.38152
700   $aKao$b Imin$01667939
702   $aChung$b Chunhui
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bUtOrBLW
906   $aBOOK
912   $a9910830592903321
996   $aWafer manufacturing$94028164
997   $aUNINA