02135oam 2200469 450 991083059290332120210615234443.01-118-69625-51-118-69623-91-118-69622-0(CKB)4330000000006815(MiAaPQ)EBC6452654(OCoLC)1183400300(OCoLC-P)1183400300(CaSebORM)9780470061213(EXLCZ)99433000000000681520210615d2021 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierWafer manufacturing shaping of single crystal silicon wafers /Imin Kao, Chunhui ChungFirst edition.Hoboken, New Jersey :John Wiley & Sons, Incorporated,[2021]©20211 online resource (307 pages) illustrationsIncludes index.0-470-06121-9 "A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."--Provided by publisher.Semiconductor wafersDesign and constructionSemiconductor wafersDesign and construction.621.38152Kao Imin1667939Chung ChunhuiMiAaPQMiAaPQUtOrBLWBOOK9910830592903321Wafer manufacturing4028164UNINA