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Advances in modeling and design of adhesively bonded systems [[electronic resource] /] / edited by S. Kumar and K.L. Mittal



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Autore: Kumar S Visualizza persona
Titolo: Advances in modeling and design of adhesively bonded systems [[electronic resource] /] / edited by S. Kumar and K.L. Mittal Visualizza cluster
Pubblicazione: Hoboken, : Wiley, 2013
Descrizione fisica: 1 online resource (280 p.)
Disciplina: 621.825
Soggetto topico: System design
Mathematical models
Altri autori: MittalK. L. <1945->  
Note generali: Description based upon print version of record.
Nota di bibliografia: Includes bibliographical references and index.
Nota di contenuto: Cover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; 1 Stress and Strain Analysis of Symmetric Composite Single Lap Joints Under Combined Tension and In-Plane Shear Loading; 1.1 Introduction; 1.2 Equations and Solution; 1.2.1 Model Description; 1.2.2 Governing Equations for Tension Loading Nx; 1.2.3 Governing Equation for In-Plane Shear Loading Nxy; 1.2.4 Solutions; 1.2.4.1 Adhesive Peel Stress azz Due to Nx; 1.2.4.2 Adhesive Shear Stress axz Due to Nx; 1.2.4.3 Adhesive Shear Stress ayz Due to Nxy; 1.3 Solution Verification; 1.4 Yield Criterion; 1.5 Case Studies
1.6 SummaryReferences; 2 Finite Element Modeling of Viscoelastic Behavior and Interface Damage in Adhesively Bonded Joints; 2.1 Introduction; 2.2 Finite Element Analysis of Viscoelastic Adhesively Bonded Joints; 2.2.1 Constitutive Relation; 2.2.2 Numerical Example; 2.2.2.1 Stress Distribution along Overlap Length; 2.2.2.2 Effect of Thermal Expansion; 2.3 Damage Analysis of Viscoelastic Adhesively Bonded Joints; 2.3.1 Constitutive Relation of Cohesive Element; 2.3.1.1 Linear Elastic Traction-Separation Law; 2.3.1.2 Damage Initiation and Evolution; 2.3.2 Numerical Example
2.3.2.1 Joint Stiffness2.3.2.2 Damage of Cohesive Elements; 2.3.2.3 Effects of Interface Damage on Adhesive Layer; 2.4 Summary and Conclusions; Acknowledgements; References; 3 Modeling of Cylindrical Joints with a Functionally Graded Adhesive Interlayer; 3.1 Introduction; 3.2 Axisymmetric Model; 3.2.1 Stress Fields in the Bonded Assembly; 3.2.1.1 Inner Adherend; 3.2.1.2 Adhesive; 3.2.1.3 Outer Adherend; 3.2.2 Stiffness Tailored Adhesive Interlayer; 3.2.2.1 Tubular Joints; 3.2.2.2 Shaft-Tube Joints; 3.3 Constitutive Models of the Adherends and FMGB Adhesive; 3.4 Variational Approach
3.4.1 Case I: FMGB13.4.2 Case II: FMGB; 3.4.3 Case III: MMB1; 3.4.4 Case IV: MMB; 3.5 Solution Procedure; 3.6 Results and discussion; 3.6.1 Influence of Bond Length (L); 3.6.2 Influence of Modulus Function; 3.6.3 Influence of Stiffness Mismatch; 3.7 Summary; References; 4 A Simplified Stress Analysis of Bonded Joints Using Macro-Elements; 4.1 Introduction; 4.1.1 Context; 4.1.2 Objective; 4.1.3 Overview of the Simplified Linear Elastic Method; 4.1.4 Overview of the Paper; 4.2 Linear Elastic 1D-Bar and 1D-Beam Models; 4.2.1 1D-Bar Model; 4.2.1.1 Formulation of the BBa Element
4.2.1.2 Assembly of the Stiffness Matrix for a Single-Lap Joint4.2.2 1D-Beam Model; 4.2.2.1 Formulation of the BBe Element; 4.2.2.2 Validation on the Example Single-Lap Joint; 4.3 Assuming a Non-linear Adhesive Material; 4.3.1 Numerical Approach; 4.3.2 Example of Application to Structures: Single-Lap Joint, In-Plane Loading; 4.3.2.1 Equilibrium of the Structure; 4.3.2.2 Determination of the Nodal Residue; 4.3.2.3 Projected Stresses; 4.3.2.4 Solution Procedure; 4.3.3 Considering a Bi-Triangular Damage Evolution Adhesive Behavior; 4.4 Validation; 4.4.1 Overview
4.4.2 FE Models for a Validation Purpose
Sommario/riassunto: The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective Adhesively bonded systems have found applications in a wide spectrum of industries (e.g., aerospace, electronics, construction, ship building, biomedical, etc.) for a variety of purposes. Emerging adhesive materials with im
Titolo autorizzato: Advances in modeling and design of adhesively bonded systems  Visualizza cluster
ISBN: 1-118-75407-7
1-118-75368-2
1-118-75420-4
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910141572303321
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Serie: Adhesion and adhesives: fundamental and applied aspects.