Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
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| Titolo: |
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
|
| Pubblicazione: | Materials Park, OH, : ASM International, 2005 |
| Descrizione fisica: | 1 online resource (302 p.) |
| Disciplina: | 621.381/046 |
| Soggetto topico: | Microelectronic packaging - Reliability |
| Solder and soldering | |
| Lead-free electronics manufacturing processes | |
| Altri autori: |
ShangguanDongkai <1963->
|
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Nota di contenuto: | ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects"" |
| ""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" | |
| Titolo autorizzato: | Lead-free solder interconnect reliability |
| ISBN: | 1-61503-093-X |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910791454203321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |