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Record Nr. |
UNINA9910791454203321 |
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Titolo |
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan |
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Pubbl/distr/stampa |
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Materials Park, OH, : ASM International, 2005 |
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ISBN |
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Descrizione fisica |
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1 online resource (302 p.) |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Microelectronic packaging - Reliability |
Solder and soldering |
Lead-free electronics manufacturing processes |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects"" |
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" |
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