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200 1 $aWelfare economics$fRobin Boadway , Neil Bruce
210   $aOxford$cB. Blackwell$d1984
215   $aVIII , 343 p. , 24 cm
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200 00$aLead-free solder interconnect reliability$b[electronic resource] /$fedited by Dongkai Shangguan
210   $aMaterials Park, OH $cASM International$d2005
215   $a1 online resource (302 p.)
300   $aDescription based upon print version of record.
311   $a0-87170-816-7 
320   $aIncludes bibliographical references and index.
327   $a""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
327   $a""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
606   $aMicroelectronic packaging$xReliability
606   $aSolder and soldering
606   $aLead-free electronics manufacturing processes
615  0$aMicroelectronic packaging$xReliability.
615  0$aSolder and soldering.
615  0$aLead-free electronics manufacturing processes.
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