Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / / edited by Beth Keser and Steffen Kröhnert
(Visualizza in formato marc)
(Visualizza in BIBFRAME)
| Titolo: |
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / / edited by Beth Keser and Steffen Kröhnert
|
| Pubblicazione: | Piscataway, New Jersey ; ; Hoboken, New Jersey : , : IEEE Press : , : Wiley, , [2022] |
| ©2022 | |
| Descrizione fisica: | 1 online resource (323 pages) |
| Disciplina: | 621.395 |
| Soggetto topico: | Chip scale packaging |
| Integrated circuits - Wafer-scale integration | |
| Microelectronics | |
| Persona (resp. second.): | KeserBeth <1971-> |
| KroehnertSteffen <1970-> | |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Titolo autorizzato: | Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces |
| ISBN: | 1-119-79389-0 |
| 1-119-79390-4 | |
| 1-119-79384-X | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910555144103321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
IEEE Press Ser.