01853nam 2200493 450 991055514410332120220824134915.01-119-79389-01-119-79390-41-119-79384-X(MiAaPQ)EBC6820545(Au-PeEL)EBL6820545(CKB)19968400400041(EXLCZ)991996840040004120220824d2022 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierEmbedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package /edited by Beth Keser and Steffen KröhnertPiscataway, New Jersey ;Hoboken, New Jersey :IEEE Press :Wiley,[2022]©20221 online resource (323 pages)IEEE Press Ser.Print version: Keser, Beth Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces Newark : John Wiley & Sons, Incorporated,c2022 9781119793779 Includes bibliographical references and index.IEEE Press Ser.Chip scale packagingIntegrated circuitsWafer-scale integrationMicroelectronicsChip scale packaging.Integrated circuitsWafer-scale integration.Microelectronics.621.395Keser Beth1971-Kroehnert Steffen1970-MiAaPQMiAaPQMiAaPQBOOK9910555144103321Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces2816245UNINA