Vai al contenuto principale della pagina

1998 International Conference on Multichip Modules and High Density Packaging



(Visualizza in formato marc)    (Visualizza in BIBFRAME)

Titolo: 1998 International Conference on Multichip Modules and High Density Packaging Visualizza cluster
Pubblicazione: [Place of publication not identified], : IEEE, 1998
Disciplina: 621.381/046
Soggetto topico: Multichip modules (Microelectronics) - Congresses
Microelectronic packaging
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Note generali: Bibliographic Level Mode of Issuance: Monograph
Titolo autorizzato: 1998 International Conference on Multichip Modules and High Density Packaging  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910872663403321
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
1997 International Symposium on Advanced Packaging Materials
Proceedings of the 1997 1st Electronic Packaging Technology Conference