LEADER 01751oam  2200481zu 450 
001 9910872663403321
005 20241212214908.0
035   $a(CKB)111026746722806
035   $a(SSID)ssj0000445441
035   $a(PQKBManifestationID)12146976
035   $a(PQKBTitleCode)TC0000445441
035   $a(PQKBWorkID)10485500
035   $a(PQKB)10378896
035   $a(EXLCZ)99111026746722806
100   $a20160829d1998      uy 
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1998 International Conference on Multichip Modules and High Density Packaging
210 31$a[Place of publication not identified]$cIEEE$d1998
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9780780348509 
311 08$a0780348508 
606   $aMultichip modules (Microelectronics)$xCongresses
606   $aMicroelectronic packaging$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aElectrical Engineering$2HILCC
615  0$aMultichip modules (Microelectronics)$xCongresses.
615  0$aMicroelectronic packaging
615  7$aElectrical & Computer Engineering
615  7$aEngineering & Applied Sciences
615  7$aElectrical Engineering
676   $a621.381/046
712 02$aInternational Microelectronics and Packaging Society
712 02$aIEEE, Institute of Electrical and Electronics Engineers, Inc. Staff
712 12$aInternational Conference on Multichip Modules and High Density Packaging
801  0$bPQKB
906   $aPROCEEDING
912   $a9910872663403321
996   $a1998 International Conference on Multichip Modules and High Density Packaging$92504364
997   $aUNINA