01751oam 2200481zu 450 991087266340332120241212214908.0(CKB)111026746722806(SSID)ssj0000445441(PQKBManifestationID)12146976(PQKBTitleCode)TC0000445441(PQKBWorkID)10485500(PQKB)10378896(EXLCZ)9911102674672280620160829d1998 uy engtxtccr1998 International Conference on Multichip Modules and High Density Packaging[Place of publication not identified]IEEE1998Bibliographic Level Mode of Issuance: Monograph9780780348509 0780348508 Multichip modules (Microelectronics)CongressesMicroelectronic packagingCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCMultichip modules (Microelectronics)Congresses.Microelectronic packagingElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381/046International Microelectronics and Packaging SocietyIEEE, Institute of Electrical and Electronics Engineers, Inc. StaffInternational Conference on Multichip Modules and High Density PackagingPQKBPROCEEDING99108726634033211998 International Conference on Multichip Modules and High Density Packaging2504364UNINA