2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers
(Visualizza in formato marc)
(Visualizza in BIBFRAME)
| Titolo: |
2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers
|
| Pubblicazione: | Piscataway, NJ : , : IEEE, , [2015] |
| ©2015 | |
| Descrizione fisica: | 1 online resource (353 pages) : illustrations |
| Disciplina: | 621 |
| Soggetto topico: | Three-dimensional integrated circuits |
| Note generali: | Includes index. |
| Sommario/riassunto: | Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. |
| Altri titoli varianti: | 2015 International 3D Systems Integration Conference |
| 3D Systems Integration Conference | |
| Titolo autorizzato: | 2015 International 3D Systems Integration Conference (3DIC 2015) |
| ISBN: | 1-4673-9385-1 |
| 1-4673-9386-X | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910135064303321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |