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100   $a20230420d2015      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a2015 International 3D Systems Integration Conference (3DIC 2015) $eSendai, Japan, 31 August - 2 September 2015 /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, NJ :$cIEEE,$d[2015]
210  4$dİ2015
215   $a1 online resource (353 pages) $cillustrations
300   $aIncludes index.
330   $aAnnotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.
517   $a2015 International 3D Systems Integration Conference 
517   $a3D Systems Integration Conference 
606   $aThree-dimensional integrated circuits$vCongresses
615  0$aThree-dimensional integrated circuits
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906   $aPROCEEDING
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996   $a2015 International 3D Systems Integration Conference (3DIC 2015)$93088716
997   $aUNINA