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Record Nr. |
UNINA9910135064303321 |
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Titolo |
2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015 / / Institute of Electrical and Electronics Engineers |
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Pubbl/distr/stampa |
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Piscataway, NJ : , : IEEE, , [2015] |
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©2015 |
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ISBN |
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1-4673-9385-1 |
1-4673-9386-X |
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Descrizione fisica |
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1 online resource (353 pages) : illustrations |
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Disciplina |
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Soggetti |
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Three-dimensional integrated circuits |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Sommario/riassunto |
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Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. |
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