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Lead-free solder interconnect reliability / / edited by Dongkai Shangguan



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Titolo: Lead-free solder interconnect reliability / / edited by Dongkai Shangguan Visualizza cluster
Pubblicazione: Materials Park, OH, : ASM International, 2005
Edizione: 1st ed.
Descrizione fisica: 1 online resource (302 p.)
Disciplina: 621.381/046
Soggetto topico: Microelectronic packaging - Reliability
Solder and soldering
Lead-free electronics manufacturing processes
Altri autori: ShangguanDongkai <1963->  
Note generali: Description based upon print version of record.
Nota di bibliografia: Includes bibliographical references and index.
Nota di contenuto: ""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
Titolo autorizzato: Lead-free solder interconnect reliability  Visualizza cluster
ISBN: 1-61503-093-X
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910809229003321
Lo trovi qui: Univ. Federico II
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