02615nam 22005654a 450 991080922900332120200520144314.01-61503-093-X(CKB)2560000000049842(EBL)3002391(OCoLC)729262390(SSID)ssj0000485519(PQKBManifestationID)11307144(PQKBTitleCode)TC0000485519(PQKBWorkID)10603902(PQKB)10073509(MiAaPQ)EBC3002391(Au-PeEL)EBL3002391(CaPaEBR)ebr10320384(EXLCZ)99256000000004984220050525d2005 uy 0engurcn|||||||||txtccrLead-free solder interconnect reliability /edited by Dongkai Shangguan1st ed.Materials Park, OH ASM International20051 online resource (302 p.)Description based upon print version of record.0-87170-816-7 Includes bibliographical references and index.""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""Microelectronic packagingReliabilitySolder and solderingLead-free electronics manufacturing processesMicroelectronic packagingReliability.Solder and soldering.Lead-free electronics manufacturing processes.621.381/046Shangguan Dongkai1963-1613294MiAaPQMiAaPQMiAaPQBOOK9910809229003321Lead-free solder interconnect reliability3942491UNINA