LEADER 02615nam  22005654a 450 
001 9910809229003321
005 20200520144314.0
010   $a1-61503-093-X
035   $a(CKB)2560000000049842
035   $a(EBL)3002391
035   $a(OCoLC)729262390
035   $a(SSID)ssj0000485519
035   $a(PQKBManifestationID)11307144
035   $a(PQKBTitleCode)TC0000485519
035   $a(PQKBWorkID)10603902
035   $a(PQKB)10073509
035   $a(MiAaPQ)EBC3002391
035   $a(Au-PeEL)EBL3002391
035   $a(CaPaEBR)ebr10320384
035   $a(EXLCZ)992560000000049842
100   $a20050525d2005      uy         0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt
182   $cc
183   $acr
200 00$aLead-free solder interconnect reliability /$fedited by Dongkai Shangguan
205   $a1st ed.
210   $aMaterials Park, OH $cASM International$d2005
215   $a1 online resource (302 p.)
300   $aDescription based upon print version of record.
311   $a0-87170-816-7 
320   $aIncludes bibliographical references and index.
327   $a""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""
327   $a""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""
606   $aMicroelectronic packaging$xReliability
606   $aSolder and soldering
606   $aLead-free electronics manufacturing processes
615  0$aMicroelectronic packaging$xReliability.
615  0$aSolder and soldering.
615  0$aLead-free electronics manufacturing processes.
676   $a621.381/046
701   $aShangguan$b Dongkai$f1963-$01613294
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910809229003321
996   $aLead-free solder interconnect reliability$93942491
997   $aUNINA