1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits / / Institute of Electrical and Electronics Engineers

• Pubblicazione: New York, New York : , : IEEE, , 2020
• Descrizione fisica: 1 online resource (73 pages)
• Disciplina: 621.38132
• Soggetto topico: Microwave transmission lines - Standards
• Sommario/riassunto: IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding.
• Titolo autorizzato: 1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
• ISBN: 1-5044-6343-9
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910389519303321
• Lo trovi qui: Univ. Federico II