LEADER 01124nam0-2200373---450 001 990004660950403321 005 20230906091005.0 010 $a2-85-944-074-7 035 $a000466095 035 $aFED01000466095 035 $a(Aleph)000466095FED01 100 $a19990604d1984----km-y0itay50------ba 101 0 $afre 102 $aFR 105 $ay-------001yy 200 1 $a<>ordres à Rome$fsous la direction de Claude Nicolet 210 $aParis$cPublications de La Sorbonne$d1984 215 $a280 p.$d24 cm 225 1 $aPublications de La Sorbonne$iSérie histoire ancienne et médiévale$v13 610 0 $aClassi sociali$aRoma antica 676 $a305.520937$v23$zita 676 $a937.06$v22$zita 702 1$aNicolet,$bClaude$f<1930-2010> 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990004660950403321 952 $aFONDO PROFESSOR ANTONIO GUARINO IV M 82$bG/1061$fFGBC 952 $a937.06 NIC 1$bDip.d.s.758$fFLFBC 952 $aDDR-XX A 011$b443 ddr$fDDR 959 $aFGBC 959 $aFLFBC 959 $aDDR 996 $aOrdres a Rome$9285861 997 $aUNINA LEADER 01918nam 2200337 450 001 9910389519303321 005 20231211115046.0 010 $a1-5044-6343-9 024 7 $a10.1109/IEEESTD.2020.9036129 035 $a(CKB)5280000000208121 035 $a(NjHacI)995280000000208121 035 $a(EXLCZ)995280000000208121 100 $a20231211d2020 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits /$fInstitute of Electrical and Electronics Engineers 210 1$aNew York, New York :$cIEEE,$d2020. 215 $a1 online resource (73 pages) 330 $aIEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding. 606 $aMicrowave transmission lines$xStandards 615 0$aMicrowave transmission lines$xStandards. 676 $a621.38132 801 0$bNjHacI 801 1$bNjHacl 906 $aDOCUMENT 912 $a9910389519303321 996 $a1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits$92584729 997 $aUNINA