Principles of laser materials processing : developments and applications / / Elijah, Jr. Kannatey-Asibu

• Autore: Kannatey-Asibu E.
• Pubblicazione: Hoboken, New Jersey : , : Wiley, , [2023]; ©2023
• Edizione: Second edition.
• Descrizione fisica: 1 online resource (611 pages)
• Disciplina: 621.366
• Soggetto topico: Lasers - Industrial applications
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: Cover -- Title Page -- Copyright -- Contents -- PREFACE TO THE SECOND EDITION -- PREFACE TO THE FIRST EDITION -- ABOUT THE COMPANION WEBSITE -- Part I Principles of Industrial Lasers -- Chapter 1 Laser Background -- 1.1 Laser Generation -- 1.1.1 Atomic Transitions -- 1.1.2 Lifetime -- 1.1.3 Optical Absorption -- 1.1.4 Population Inversion -- 1.1.5 Threshold Gain -- 1.1.6 Two‐Photon Absorption -- 1.2 Optical Resonators -- 1.2.1 Standing Waves In A Rectangular Cavity -- 1.2.2 Planar Resonators -- 1.2.3 Confocal Resonators -- 1.2.4 Concentric Resonators -- 1.3 Laser Pumping -- 1.3.1 Optical Pumping -- 1.3.2 Electrical Pumping -- 1.4 System Levels -- 1.4.1 Two‐Level System -- 1.4.2 Three‐Level System -- 1.5 Broadening Mechanisms -- 1.5.1 Line Shape Function -- 1.5.2 Line‐Broadening Mechanisms -- 1.5.3 Comparison of Individual Mechanisms -- 1.6 Beam Modification -- 1.6.1 Quality Factor -- 1.6.2 Q‐Switching -- 1.6.3 Mode Locking -- 1.7 Beam Characteristics -- 1.7.1 Beam Divergence -- 1.7.2 Monochromaticity -- 1.7.3 Beam Coherence -- 1.7.4 Intensity and Brightness -- 1.7.5 Focusing -- 1.8 Summary -- 1.8 Problems -- 1.8 Bibliography -- Chapter 2 Types of Lasers -- 2.1 SOLID‐STATE LASERS -- 2.1.1 The Nd:YAG Laser -- 2.1.2 The Nd:Glass Laser -- 2.2 GAS LASERS -- 2.2.1 Neutral Atom Lasers -- 2.2.2 Ion Lasers -- 2.2.3 Molecular Gas Lasers -- 2.3 SEMICONDUCTOR (DIODE) LASERS -- 2.3.1 Semiconductor Background -- 2.3.2 Semiconductor Lasers -- 2.3.3 Semiconductor Laser Types -- 2.3.4 Low‐Power Diode Lasers -- 2.3.5 High‐Power Diode Lasers -- 2.3.6 Applications of High‐Power Diode Lasers -- 2.4 NEW DEVELOPMENTS IN INDUSTRIAL LASER TECHNOLOGY -- 2.4.1 Slab Lasers -- 2.4.2 Disk Lasers -- 2.4.3 Ultrafast (Femtosecond) Lasers -- 2.4.4 Fiber Lasers -- 2.5 SUMMARY -- 2.5 Problems -- 2.5 Bibliography -- Chapter 3 Beam Delivery -- 3.1 The Electromagnetic Spectrum. ; 3.2 Birefringence -- 3.3 Brewster Angle -- 3.4 Polarization -- 3.5 Beam Expanders -- 3.6 Beam Splitters -- 3.7 Beam Delivery Systems -- 3.7.1 Conventional Beam Delivery -- 3.7.2 Fiber Optic Systems -- 3.8 Beam Shaping -- 3.8.1 Beam Shaping Using Diffractive Optics -- 3.8.2 Beam Shaping Using Coherent Beam Combining and Optical Phase Array -- 3.9 Summary -- 3.9 PROBLEMS -- 3.9 Bibliography -- Part II Engineering Background -- Chapter 4 Heat and Fluid Flow -- 4.1 Energy Balance During Processing -- 4.2 HEAT FLOW IN THE WORKPIECE -- 4.2.1 Temperature Distribution -- 4.2.2 Peak Temperatures -- 4.2.3 Cooling Rates -- 4.2.4 Gaussian Heat Source -- 4.2.5 The Two‐Temperature Model -- 4.3 FLUID FLOW IN MOLTEN POOL -- 4.3.1 Continuity Equation -- 4.3.2 Navier-Stokes Equations -- 4.3.3 Surface Tension Effect -- 4.3.4 Free Surface Modeling -- 4.4 SUMMARY -- 4.4 Problems -- 4.4 BIBLIOGRAPHY -- Chapter 5 The Microstructure -- 5.1 PROCESS MICROSTRUCTURE -- 5.1.1 Fusion Zone -- 5.1.2 Zone of Partial Melting -- 5.1.3 Heat‐Affected Zone -- 5.2 DISCONTINUITIES -- 5.2.1 Porosity -- 5.2.2 Cracking -- 5.2.3 Lack of Fusion -- 5.2.4 Incomplete Penetration -- 5.2.5 Undercut -- 5.3 SUMMARY -- 5.3 Problems -- 5.3 BIBLIOGRAPHY -- Chapter 6 Solidification -- 6.1 SOLIDIFICATION WITHOUT FLOW -- 6.1.1 Solidification of a Pure Metal -- 6.1.2 Solidification of a Binary Alloy -- 6.2 SOLIDIFICATION WITH FLOW -- 6.2.1 Mushy Fluid -- 6.2.2 Columnar Dendritic Structure -- 6.3 RAPID SOLIDIFICATION -- 6.4 SUMMARY -- 6.4 Problems -- 6.4 Bibliography -- Chapter 7 Residual Stresses and Distortion -- 7.1 CAUSES OF RESIDUAL STRESSES -- 7.1.1 Thermal Stresses -- 7.1.2 Nonuniform Plastic Deformation -- 7.2 BASIC STRESS ANALYSIS -- 7.2.1 Stress-Strain Relations -- 7.2.2 Plane Stress and Plane Strain -- 7.2.2 Solution: -- 7.3 EFFECTS OF RESIDUAL STRESSES -- 7.3.1 Apparent Change in Strength. ; 7.3.2 Distortion -- 7.4 MEASUREMENT OF RESIDUAL STRESSES -- 7.4.1 Stress Relaxation Techniques -- 7.4.1 Solution: -- 7.4.2 X‐ray Diffraction Technique -- 7.4.3 Neutron Diffraction Technique -- 7.4.4 Residual Stress Equilibrium -- 7.4.4 Solution: -- 7.5 RELIEF OF RESIDUAL STRESSES AND DISTORTION -- 7.5.1 Thermal Treatments -- 7.5.2 Mechanical Treatments -- 7.6 SUMMARY -- 7.6 Problems -- 7.6 Bibliography -- Part III Laser Materials Processing -- Chapter 8 Background on Laser Processing -- 8.1 System‐Related Parameters -- 8.1.1 Power and Power Density -- 8.1.2 Wavelength and Focusing -- 8.1.3 Beam Mode -- 8.1.4 Beam Form -- 8.1.5 Beam Quality -- 8.1.6 Beam Absorption -- 8.1.7 Beam Alignment -- 8.1.8 Motion Unit -- 8.2 Process Efficiency -- 8.3 Disturbances That Affect Process Quality -- 8.4 General Advantages and Disadvantages of Laser Processing -- 8.4.1 Advantages -- 8.4.2 Disadvantages -- 8.5 Summary -- 8.5 Problems -- 8.5 Bibliography -- Chapter 9 Laser Cutting and Drilling -- 9.1 Laser Cutting -- 9.1.1 Forms of Laser Cutting -- 9.1.2 Components of a Laser Cutting System -- 9.1.3 Processing Conditions -- 9.1.4 Laser Cutting Principles -- 9.1.5 Quality of Cut Part -- 9.1.6 Material Considerations -- 9.1.7 Advantages and Disadvantages of Laser Cutting -- 9.1.8 Specific Comparison with Conventional Processes -- 9.1.9 Special Techniques -- 9.2 Laser Drilling -- 9.2.1 Forms of Laser Drilling -- 9.2.2 Process Parameters -- 9.2.3 Analysis of Material Removal During Drilling -- 9.2.4 Advantages and Disadvantages of Laser Drilling -- 9.2.5 Applications -- 9.3 New Developments -- 9.3.1 Micromachining -- 9.3.2 Laser‐Assisted Machining -- 9.4 Summary -- 9.4 Problems -- 9.4 BIBLIOGRAPHY -- Chapter 10 Laser Welding -- 10.1 Laser Welding Parameters -- 10.1.1 Beam Power and Traverse Speed -- 10.1.2 Effect of Beam Characteristics. ; 10.1.3 Plasma Formation, Gas Shielding, and Effect of Ambient Pressure -- 10.1.4 Beam Size and Focal Point Location -- 10.1.5 Joint Configuration -- 10.2 Welding Efficiency -- 10.3 Mechanism of Laser Welding -- 10.3.1 Conduction Mode Welding -- 10.3.2 Keyhole Welding -- 10.4 Material Considerations -- 10.4.1 Steels -- 10.4.2 Nonferrous Alloys -- 10.4.3 Ceramic Materials -- 10.4.4 Dissimilar Metals -- 10.5 Weldment Discontinuities -- 10.5.1 Porosity -- 10.5.2 Humping -- 10.6 Advantages and Disadvantages of Laser Welding -- 10.6.1 Advantages -- 10.6.2 Disadvantages -- 10.7 Special Techniques -- 10.7.1 Multiple‐Beam Welding -- 10.7.2 Arc‐Augmented Laser Welding -- 10.7.3 Wobble Welding -- 10.7.4 Remote Laser Welding -- 10.8 Specific Applications -- 10.8.1 Microwelding -- 10.8.2 Laser‐Welded Tailored Blanks -- 10.8.3 Laser Transmission Welding of Plastics -- 10.8.4 Laser Brazing -- 10.9 Summary -- 10.9 Problems -- 10.9 Bibliography -- Chapter 11 Laser Surface Modification -- 11.1 Laser Surface Heat Treatment -- 11.1.1 Important Criteria -- 11.1.2 Key Process Parameters -- 11.1.3 Temperature Field -- 11.1.4 Microstructural Changes in Steels -- 11.1.5 Nonferrous Alloys -- 11.1.6 Hardness Variation -- 11.1.7 Residual Stresses -- 11.1.8 Semiconductors -- 11.1.9 Polymers -- 11.1.10 Advantages and Disadvantages of Laser Surface Treatment -- 11.2 Laser Surface Melting -- 11.3 Laser Direct Metal Deposition -- 11.3.1 Processing Parameters -- 11.3.2 Methods for Depositing the Material -- 11.3.3 Dilution -- 11.3.4 Advantages and Disadvantages of Laser Deposition -- 11.4 Laser Physical Vapor Deposition (LPVD) -- 11.5 Laser Shock Peening -- 11.5.1 Background Analysis -- 11.5.2 Thermal Relaxation at High Temperatures -- 11.5.3 Advantages and Disadvantages of Laser Shock Peening -- 11.5.4 Applications -- 11.6 Laser Texturing -- 11.7 Summary -- 11.7 Problems. ; 11.7 BIBLIOGRAPHY -- Chapter 12 Laser Forming -- 12.1 Principle of Laser Forming -- 12.2 Process Parameters -- 12.3 Laser‐Forming Mechanisms -- 12.3.1 Temperature Gradient Mechanism -- 12.3.2 Buckling Mechanism -- 12.3.3 Upsetting Mechanism -- 12.3.4 Summary of the Forming Mechanisms -- 12.4 Process Analysis -- 12.5 Advantages and Disadvantages -- 12.5.1 Advantages -- 12.5.2 Disadvantages -- 12.6 Applications -- 12.7 Summary -- 12.7 Problems -- 12.7 Bibliography -- Chapter 13 Additive Manufacturing -- 13.1 Computer‐Aided Design -- 13.1.1 Curve and Surface Design -- 13.1.2 Solid Modeling -- 13.1.3 Software Formats -- 13.1.4 Supports for Part Building -- 13.1.5 Slicing -- 13.2 Part Building -- 13.2.1 Liquid‐Based Systems -- 13.2.2 Powder‐Based Systems -- 13.2.3 Solid‐Based Systems -- 13.2.4 Qualitative Comparison of Some Major Systems -- 13.3 Post‐Processing -- 13.4 Applications -- 13.4.1 Design -- 13.4.2 Engineering, Analysis, and Planning -- 13.4.3 Manufacturing and Tooling -- 13.4.4 Personalized Production -- 13.5 Advantages and Disadvantages -- 13.5.1 Advantages -- 13.5.2 Disadvantages -- 13.6 Summary -- 13.6 Problems -- 13.6 Bibliography -- Chapter 14 Medical and Nanotechnology Applications of Lasers -- 14.1 Medical Applications -- 14.1.1 Medical Devices -- 14.1.2 Therapeutic Applications -- 14.2 Nanotechnology Applications -- 14.2.1 Nanoholes and Grating -- 14.2.2 Nanobumps -- 14.2.3 Laser‐Assisted Nanoimprint Lithography -- 14.3 Summary -- 14.3 Bibliography -- Chapter 15 Sensors for Process Monitoring -- 15.1 Laser Beam Monitoring -- 15.1.1 Beam Power -- 15.1.2 Beam Mode -- 15.1.3 Beam Size -- 15.2 Process Monitoring -- 15.2.1 Acoustic Emission (AE) -- 15.2.2 Acoustic Mirror -- 15.2.3 Audible Sound (AS) Emission -- 15.2.4 Infrared/Ultraviolet (IR/UV) Detection Techniques -- 15.2.5 Optical (Vision) Sensing -- 15.3 Summary -- 15.3 Problems. ; 15.3 BIBLIOGRAPHY.
• Titolo autorizzato: Principles of laser materials processing
• ISBN: 1-119-88163-3; 1-119-88161-7
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910830442803321
• Lo trovi qui: Univ. Federico II