Adhesive Bonding of Aircraft Composite Structures : Non-destructive Testing and Quality Assurance Concepts / / edited by Welchy Leite Cavalcanti, Kai Brune, Michael Noeske, Konstantinos Tserpes, Wiesław M. Ostachowicz, Mareike Schlag |
Autore | Leite Cavalcanti Welchy |
Edizione | [1st ed. 2021.] |
Pubbl/distr/stampa | Springer Nature, 2021 |
Descrizione fisica | 1 online resource (XVIII, 350 p. 290 illus., 259 illus. in color.) |
Disciplina | 620.11 |
Soggetto topico |
Structural materials
Aerospace engineering Astronautics Manufactures Materials science Materials—Surfaces Thin films Ceramics Glass Composites (Materials) Composite materials Structural Materials Aerospace Technology and Astronautics Manufacturing, Machines, Tools, Processes Characterization and Evaluation of Materials Surfaces and Interfaces, Thin Films Ceramics, Glass, Composites, Natural Materials |
Soggetto non controllato |
Structural Materials
Aerospace Technology and Astronautics Manufacturing, Machines, Tools, Processes Characterization and Evaluation of Materials Surfaces and Interfaces, Thin Films Ceramics, Glass, Composites, Natural Materials Machines, Tools, Processes Characterization and Analytical Technique Surfaces, Interfaces and Thin Film Ceramics NDT composites NDT aircraft CFRP NDT testing innovative lightweight materials aircraft lifecycle adhesive bonding adhesively bonded joints surface cleaning ComBoNDT Open Access Materials science Structural engineering Aerospace & aviation technology Astronautics Production engineering Testing of materials Surface chemistry & adsorption Industrial chemistry & chemical engineering |
ISBN | 3-319-92810-4 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Introduction and scenario within the industry (IFAM, Airbus) -- Samples Preparation, characterization, analyses and mechanical tests -- ENDT for surface quality assurance -- ENDT for adhesive bondline quality assurance -- Summary and technology assessment. |
Record Nr. | UNINA-9910484427903321 |
Leite Cavalcanti Welchy
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Springer Nature, 2021 | ||
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Lo trovi qui: Univ. Federico II | ||
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Science, Characterization and Technology of Joining and Welding |
Autore | Haghshenas Meysam |
Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
Descrizione fisica | 1 electronic resource (251 p.) |
Soggetto non controllato |
microstructure
phased array ultrasonic thermophysical property FRP simulation eutectoid tint etching TAN alloy dissimilar material joining thermal compression bonding HAZ cracking welding thermal cycles IN738 superalloy carbide dissolution solder friction bit joining weld bonding interfacial microstructure adhesive thermos-mechanical property API 5L X80 steel scarf joint thermal spraying pores Cr-Mo steel welding hot pressing local brittle zone electrical properties Ti2AlNb alloy tool pin profiles adhesive bonding mechanical properties carbon fiber-reinforced polymer surface structuring m23c6 Zn-coated low carbon microalloyed steels flux-less soldering dissimilar joints energy-input medium thick plate model design of experiments oxide layer mechanical interlocking rotary friction-welding 22MnB5 ultrasonic bonding titanium anisotropy coupled arc heat-affected zone aluminum plasma-TIG joint mechanical properties hybrid joining microconstituent dual-phase steel high-crystalline content zirconia flex-on-board assembly active monomers butt joint copper clad filler foil SA213-T23 arc profile numerical simulation tailor welded blanks ceramics vacuum brazing coating longitudinal wave direct diffusion bonding metallurgy pressure distribution flow stress SnBi58 solder joint morphology adhesion dissimilar weldments laser welding distributed point heat sources model mechanical strength taguchi design bonding strength friction stir welding |
ISBN | 3-03928-998-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910404080103321 |
Haghshenas Meysam
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MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
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Lo trovi qui: Univ. Federico II | ||
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