Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules / / by Ulrich H. P. Fischer-Hirchert
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| Autore: |
Fischer-Hirchert Ulrich H. P
|
| Titolo: |
Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules / / by Ulrich H. P. Fischer-Hirchert
|
| Pubblicazione: | Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2015 |
| Edizione: | 1st ed. 2015. |
| Descrizione fisica: | 1 online resource (336 p.) |
| Disciplina: | 620 |
| 620.5 | |
| 621.3 | |
| 621.3815 | |
| Soggetto topico: | Microwaves |
| Optical engineering | |
| Nanotechnology | |
| Electronic circuits | |
| Microwaves, RF and Optical Engineering | |
| Nanotechnology and Microengineering | |
| Circuits and Systems | |
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references at the end of each chapters and index. |
| Nota di contenuto: | Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index. |
| Sommario/riassunto: | This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. |
| Titolo autorizzato: | Photonic Packaging Sourcebook |
| ISBN: | 3-642-25376-8 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910299841503321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |
Serie:
Springer engineering ebooks.