{"text_format":"2","workbook":"xls","n_sheets":1,"sheets":["report2"],"not_rendered":{"charts":0,"images":0,"macros":0,"external_links":1,"defined_names":2,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"run_cost":"one","rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"report2","index":0,"n_rows":37,"n_cols":5,"rows_kept":37,"cut":false,"hidden":false,"merged":[[0,2,0,3],[0,4,0,5],[1,2,1,3],[1,4,1,5],[2,2,2,3],[2,4,2,5],[3,2,3,3],[4,2,4,3],[5,2,5,3],[6,2,6,3],[7,2,7,3],[8,2,8,3],[9,2,9,3],[11,2,11,3],[11,4,11,5],[12,2,12,3],[12,4,12,5],[13,2,13,3],[13,4,13,5],[14,2,14,3],[15,2,15,3],[16,2,16,3],[17,2,17,3],[18,2,18,3],[22,2,22,3],[29,2,29,3],[30,2,30,3],[34,2,34,3]],"flags":["formulas_cached_only"]}
[null,"1.","Record Nr.",null,"UNINA990005439890403321"]
[null,null,"Autore",null,"Akerström, Ake"]
[null,null,"Titolo",null,"Studien über die etruskischen Gräber unter besonderer Berücksichtigung der Entwicklung des Kammergrabes / von Ake Akerström"]
[null,null,"Pubbl/distr/stampa",null,"Lund etc., : C.W.K. Gleerup etc., 1934"]
[null,null,"Descrizione fisica",null,"210 p. ; 31 cm"]
[null,null,"Collana",null,"Skrifter utgivna av Svenska Institutet i Rom , Series in 4. ; 3"]
[null,null,"Locazione",null,"FLFBC"]
[null,null,"Collocazione",null,"ARCH. I 051 4"]
[null,null,"Lingua di pubblicazione",null,"Tedesco"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,"2.","Record Nr.",null,"UNINA9910299841503321"]
[null,null,"Autore",null,"Fischer-Hirchert Ulrich H. P"]
[null,null,"Titolo",null,"Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules / / by Ulrich H. P. Fischer-Hirchert"]
[null,null,"Pubbl/distr/stampa",null,"Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2015"]
[null,null,"ISBN",null,"3-642-25376-8"]
[null,null,"Edizione",null,"[1st ed. 2015.]"]
[null,null,"Descrizione fisica",null,"1 online resource (336 p.)"]
[null,null,"Disciplina",null,"620"]
[{"$nulls":4},"620.5"]
[{"$nulls":4},"621.3"]
[{"$nulls":4},"621.3815"]
[null,null,"Soggetti",null,"Microwaves"]
[{"$nulls":4},"Optical engineering"]
[{"$nulls":4},"Nanotechnology"]
[{"$nulls":4},"Electronic circuits"]
[{"$nulls":4},"Microwaves, RF and Optical Engineering"]
[{"$nulls":4},"Nanotechnology and Microengineering"]
[{"$nulls":4},"Circuits and Systems"]
[null,null,"Lingua di pubblicazione",null,"Inglese"]
[null,null,"Formato",null,"Materiale a stampa"]
[null,null,null,"Livello bibliografico","Monografia"]
[null,null,null,"Note generali","Description based upon print version of record."]
[null,null,null,"Nota di bibliografia","Includes bibliographical references at the end of each chapters and index."]
[null,null,"Nota di contenuto",null,"Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index."]
[null,null,null,"Sommario/riassunto","This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi "]
[{"$nulls":4},"fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects."]