Silicon Semiconductor Technology [[electronic resource] ] : Processing and Integration of Microelectronic Devices / / by Ulrich Hilleringmann

• Autore: Hilleringmann Ulrich
• Pubblicazione: Wiesbaden : , : Springer Fachmedien Wiesbaden : , : Imprint : Springer Vieweg, , 2023
• Edizione: 1st ed. 2023.
• Descrizione fisica: 1 online resource (271 pages)
• Disciplina: 621.38152
• Soggetto topico: Electronics; Electronic circuits; Semiconductors; Electronics and Microelectronics, Instrumentation; Electronic Circuits and Systems
• Nota di contenuto: Wafer fabrication -- Thermal oxidation -- Lithography -- Etching technology -- Doping techniques -- Chemical and Physical Deposition -- Metallization and Contacts.
• Sommario/riassunto: The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view. The Content Wafer fabrication Thermal oxidation Lithography Etching technology Doping techniques Chemical and Physical Deposition Metallization and Contacts About the Author Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.
• Titolo autorizzato: Silicon Semiconductor Technology
• ISBN: 3-658-41041-8
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910736986403321
• Lo trovi qui: Univ. Federico II